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Method for separating semiconductor silicon wafers from e.g. polycrystalline crystal block for electronic application, involves choosing lengths of saw wire moved in respective directions such that wire point completes number of cycles
Method for separating semiconductor silicon wafers from e.g. polycrystalline crystal block for electronic application, involves choosing lengths of saw wire moved in respective directions such that wire point completes number of cycles
The method involves periodically reversing a running direction of parallelly moved wires (3) formed by a saw wire (2) from a forward direction to a reverse direction. Length (L) of a workpiece (4) is deviated from reference length, and a pitch (T) of a wire saw is deviated from a reference pitch. Lengths of the saw wire moved in respective forward and reverse directions are chosen in such a manner that a wire point of the saw wire completes a number of cycles from entering of the workpiece up to exit of the workpiece.
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