首页>
外国专利>
SEMICONDUCTOR PACKAGE MANUFACTURING MOLDING APPARATUS CAPABLE OF COMPLETING A SEMICONDUCTOR PACKAGE BY MOLDING-PROCESSING THE PACKAGE HALF-PRODUCT IN WHICH WIRE BONDING IS COMPLETED USING MOLDING RESIN
SEMICONDUCTOR PACKAGE MANUFACTURING MOLDING APPARATUS CAPABLE OF COMPLETING A SEMICONDUCTOR PACKAGE BY MOLDING-PROCESSING THE PACKAGE HALF-PRODUCT IN WHICH WIRE BONDING IS COMPLETED USING MOLDING RESIN
展开▼
机译：能够通过模制来加工半成品的半成品的封装装置，该半成品是通过使用模制树脂来完成引线键合的半成品
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: A semiconductor package manufacturing molding apparatus is provided to reduce safety accidents by replacing a gauge block without detaching and attaching a hot mold from equipment when forming the semiconductor packages in which thickness is different.;CONSTITUTION: The receiving space in which a package half-product is fixed is included in a low mold(20). An upper mold(30) is arranged in the upper side of the low mold and the cavity(40) in which the molding resin is inserted is formed in the upper mold. An elevating plate(32) controls the height of cavity while the upper mold is ascended and descended to the upward and downward. A first inclined plane is formed in the upper side of the elevating plate. A slide plate(34) is arranged in the upper side of the elevating plate. The second inclined plane coping with the first inclined plane is formed in the lower side of the elevating plate. An operating unit(50) transmits the slide plate in a straight direction.;COPYRIGHT KIPO 2012
展开▼
