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A physical vapour deposition coating device as well as a physical vapour deposition method

机译:物理气相沉积涂覆装置以及物理气相沉积方法

摘要

The invention relates to a physical vapour deposition coating device (1), comprising a process chamber (2) with an anode (3) and a consumable cathode (4) to be consumed by an electrical discharge for coating a substrate located within the process chamber (2). The coating device (1) further includes a first electrical energy source (5) being connected with its negative pole to said consumable cathode (4), and a second electrical energy source (6) being connected with its positive pole to said anode (3). According to the invention, a third electrical energy source (7) is provided being connected with its negative pole to a source cathode (8) which is different from the consumable cathode (4). In addition, the invention relates to a physical vapour deposition method for coating a substrate.
机译:本发明涉及一种物理气相沉积涂覆设备(1),其包括具有阳极(3)和消耗性阴极(4)的处理室(2),该阳极将由放电消耗以涂覆位于处理室内的基板(2)。涂覆装置(1)还包括第一电源(5),其负极连接至所述可消耗阴极(4),以及第二电源(6),其正极连接至所述阳极(3)。 )。根据本发明,提供了第三电源(7),该第三电源的负极连接到与可消耗阴极(4)不同的源阴极(8)。另外,本发明涉及用于涂覆基材的物理气相沉积方法。

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