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Pressure sensors e.g. acoustic wave sensors, collective manufacturing method, involves reducing diaphragm thickness of sensors by etching for attaining thickness equal to diaphragm thickness of target resonator or target sensitivity
Pressure sensors e.g. acoustic wave sensors, collective manufacturing method, involves reducing diaphragm thickness of sensors by etching for attaining thickness equal to diaphragm thickness of target resonator or target sensitivity
The method involves manufacturing a resonator e.g. pressure surface acoustic wave resonator, of pressure sensors. Sensitivity values ranging between minimum and maximum values, of sensors are measured. The values are cut into elementary sub sets, where each sub-set presents dispersion sensitivity. Diaphragm thickness (h) of the sensors of same sub-set is reduced by etching for attaining a thickness equal to a diaphragm thickness of target resonator during thickness reduction or attaining target sensitivity during increase of thickness by deposition process e.g. laser ablation.
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