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Opto-electronic semiconductor component, has opaque material for covering conductive strips of connection carrier and areas of chip connection region and for uncovering radiation passage surface of opto-electronic semiconductor chip
Opto-electronic semiconductor component, has opaque material for covering conductive strips of connection carrier and areas of chip connection region and for uncovering radiation passage surface of opto-electronic semiconductor chip
The component has a connection carrier (1) with conductive strips (2) and a chip connection region (3). An opto-electronic semiconductor chip (4) is superimposed on the connection region. An opaque material (6) covers the conductive strips and areas of the chip connection region. A radiation passage surface of the semiconductor chip is uncovered by the opaque material. A frame (8) surrounds the chip connection region by four sides. The opaque material comprises light absorbent particles (7a), which are attached into a matrix material. An independent claim is also included for a method for manufacturing an opto-electronic semiconductor component.
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