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Opto-electronic semiconductor component, has main housing body surrounding opto-electronic semiconductor chip and made of radiation permeable matrix material, and radiation reflected filling material introduced into body
Opto-electronic semiconductor component, has main housing body surrounding opto-electronic semiconductor chip and made of radiation permeable matrix material, and radiation reflected filling material introduced into body
The component has a main housing body (1) surrounding an opto-electronic semiconductor chip (2) e.g. photodiode chip, and made of radiation permeable matrix material (3) e.g. fluoropolymer and modified polytetrafluoroethylene. A radiation reflected filling material (4) is introduced into the body, and includes metallic particles, mineral particles and particles e.g. titanium dioxide, aluminum oxide, zinc oxide, and barium sulfate. A mechanically stabilized filling material (5) is brought into the matrix material and is provided with mineral fibers e.g. glass fibers and carbon fibers.
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