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The method of electro co-deposition to Ag-Cu eutectic alloy
The method of electro co-deposition to Ag-Cu eutectic alloy
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机译：Ag-Cu共晶合金的电共沉积方法
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摘要
The present invention satisfies the conductivity and ceramic and adhesion, corrosion resistance in a microwave oven magnetron part of the shield disk relates to a method of plating can shield disc on the Ag-Cu-based alloy to process, more specifically to environmentally friendly complexing agents Non CN- using Ag-Cu-based process (Ag78% wt-Cu22% wt) alloy plating be carried may have excellent adhesion and corrosion resistance characteristics at a time, such Ag-Cu alloy with the effect of cost reduction due to secondary contamination during plating is fused (Brazing) also in corrosion resistance under severe conditions to increase the adhesion at the bonding interface relates to a plating method of the Ag-Cu-based alloy the process can have a superior performance. ; Ag-Cu-based process (Ag78% wt-Cu22% wt) The preferred conditions for obtaining the alloy plating of the present invention and has a pH control agent (adjust) NH 4 with OH and fair pH10, 0.3M AgNO 3 , 0.27M Cu (NO 3 ) 2 3H 2 O, 0.5MC 4 H 5 NO 2 (number shinny polyimide) 3.5A / dm 2 -5.5A / dm 2 in the current density has a feature that can achieve the desired process based alloys in the condition.
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