首页>
外国专利>
THE METHOD OF ELECTRO CO-DEPOSITION TO AG-CU EUTECTIC ALLOY
THE METHOD OF ELECTRO CO-DEPOSITION TO AG-CU EUTECTIC ALLOY
展开▼
机译：Ag-Cu共晶合金的电子共沉积方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention relates to a plating method and of the conductive ceramic with adhesive, the shield Ag-Cu-based alloy on the process disk that the corrosion resistance can be satisfied with the magnetron part of the shield disk of the microwave oven, and more particularly environmentally friendly Non CN- using complexing agents Ag-Cu-based process (Ag78-Cu22% wt% wt) such Ag- with the effects of cost reduction due to the adhesion and corrosion resistance, and if you have an excellent property at a time, subjected to secondary pollution alloys Cu alloy plating relates to a plating method of Fig. Ag-Cu-alloy process, which may have excellent corrosion resistance performance under severe conditions by increasing the adhesion at the bonding interface when Brazing.; Ag-Cu-based process (Ag78-Cu22% wt% wt) The preferred conditions for obtaining the alloy plating of the present invention and a titration to pH10 pH adjust NH 4 OH, 0.3M AgNO 3, 0.27M Cu (NO 3) 2 3H 2 O, has a characteristic to obtain a desired process based alloy under conditions 0.5M Succinimide to 3.5A / dm 2 -5.5A / dm 2 current density.
展开▼
