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Method of fabricating a contact with a post contact plug anneal

机译:用接触后插塞退火制造接触的方法

摘要

The present invention provides a process for fabricating a contact plug in a semiconductor substrate having a contact opening formed therein that comprises depositing a barrier layer in the contact opening and on at least a portion of the semiconductor substrate, depositing a contact metal on the barrier layer within the contact opening, removing a substantial portion of the contact metal and the barrier layer from the semiconductor substrate and forming a contact plug within the contact opening, and subjecting the contact plug to a temperature sufficient to anneal the barrier layer.
机译:本发明提供了一种在具有形成于其中的接触开口的半导体衬底中制造接触插塞的方法,该方法包括在接触开口中以及在半导体衬底的至少一部分上沉积阻挡层,在阻挡层上沉积接触金属。在接触孔内,从半导体衬底上除去大部分的接触金属和阻挡层,并在接触孔内形成接触塞,并使接触塞经受足以退火阻挡层的温度。

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