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Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly
Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly
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机译：用于在倒装芯片安装和制造微电子组件的底部填充工艺步骤中减少倒装芯片凸点应力的方法
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摘要
A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the substrate and the fixture to reflow the conductive bumps on the flip chip, cooling the flip chip, substrate and fixture to solidify the conductive bumps and to mount the flip chip to the substrate, depositing an underfill between the flip chip and the substrate, curing the underfill by heating the flip chip, substrate, underfill and fixture to an elevated temperature, and removing the flip chip mounted substrate from the fixture.
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