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Semiconductor chip manufacture system for formation of chips on semiconductor wafer involves formation of pits in rear surface, plating with solder and application of solder to fill pits
Semiconductor chip manufacture system for formation of chips on semiconductor wafer involves formation of pits in rear surface, plating with solder and application of solder to fill pits
The semiconductor wafer (100) has active regions (210) of semiconductor chips (200) formed on its front side (200). There are grooves (104) between individual chips. The rear side of the wafer (102) is initially smooth. The manufacturing system involves formation of pits in the rear surface, leaving upstanding regions. The pits and upstanding regions are plated with solder. A thick layer of solder is applied to fill the pits, using a doctor blade to smooth the solder.
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