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PGA PACKAGE AND SOCKET FOR INSPECTING PGA PACKAGE, ESPECIALLY IN RELATION TO HAVING AN ELECTRICALLY CONNECTABLE STRUCTURE IN PLURAL POINTS BY CORRESPONDING TO THE NUMBER OF INCREASED INPUT/OUTPUT TERMINALS WITHIN A LIMITED PACKAGE SIZE
PGA PACKAGE AND SOCKET FOR INSPECTING PGA PACKAGE, ESPECIALLY IN RELATION TO HAVING AN ELECTRICALLY CONNECTABLE STRUCTURE IN PLURAL POINTS BY CORRESPONDING TO THE NUMBER OF INCREASED INPUT/OUTPUT TERMINALS WITHIN A LIMITED PACKAGE SIZE
PURPOSE: A PGA(Pin Grid Array) package and a socket for inspecting the PGA package are provided to include the first contacts consisting of plural pins and the second contacts electrically connectable to input/output terminals through plural pin holes, thereby obtaining a desired number of contacts without increasing a PGA package size. CONSTITUTION: A PGA package(10) comprises a substrate(12) where a semiconductor chip having plural input/output terminals is mounted on an upper side. Plural pins(14) electrically connected to the input/output terminals of the semiconductor chip are protruded from a lower surface(12a) of the substrate(12). The plural pins(14) form the first contacts of the PGA package(10). Plural pin holes(16) are formed on the lower surface(12a) of the substrate(12). The second contacts(18) electrically connectable to the input/output terminals are formed inside the pin holes(16).
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