Method for placing active circuits beneath active bonding pads

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• 2. 在多层电路板结构中形成的声学有源元件、在多层电路板结构中形成声学有源元件的方法、及多层电路板结构 [P] . 中国专利： CN1659925A . 2005-08-24
• 3. Method for placing active circuits beneath active bonding pads [P] . 美国专利： USRE41355E . 2010-05-25

  机译： 将有源电路置于有源焊盘下方的方法

• 4. Bond pad stacks for ESD under a pad and bonding an active circuit underneath a pad [P] . 德国专利： DE102008027466A1 . 2009-02-05

  机译： 用于焊盘下的ESD的焊盘焊盘叠层，以及焊盘下的有源电路的焊盘焊盘叠层

• 5. Wire bonding to full array bonding pads on active circuitry [P] . 美国专利： US2004178498A1 . 2004-09-16

  机译： 引线键合至有源电路上的全阵列键合焊盘

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