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Correction of wafer temperature drift in a plasma reactor based upon continuous wafer temperature measurements using an in-situ wafer temperature optical probe

机译:使用原位晶圆温度光学探头,基于连续的晶圆温度测量,对等离子体反应器中的晶圆温度漂移进行校正

摘要

The invention solves the problem of continuously monitoring wafer temperature during processing using an optical or fluoro-optical temperature sensor including an optical fiber having an end next to and facing the backside of the wafer. This optical fiber is accommodated without disturbing plasma processing by providing in one of the wafer lift pins an axial void through which the optical fiber passes. The end of the fiber facing the wafer backside is coincident with the end of the hollow lift pin. The other end is coupled via an “external” optical fiber to temperature probe electronics external of the reactor chamber. The invention uses direct wafer temperature measurements with a test wafer to establish a data base of wafer temperature behavior as a function of coolant pressure and a data base of wafer temperature behavior as a function of wafer support or “puck” temperature. These data bases are then employed during processing of a production wafer to control coolant pressure in such a manner as to minimize wafer temperature deviation from the desired temperature.
机译:本发明解决了使用光学或氟光学温度传感器在处理过程中连续监测晶片温度的问题,所述光学或氟光学温度传感器包括具有紧邻并面对晶片背面的一端的光纤。通过在晶片提升销之一中提供光纤穿过的轴向空隙,可容纳该光纤而不会干扰等离子体处理。面对晶片背面的光纤末端与空心提升销的末端重合。另一端通过“外部”光纤到反应室外部的温度探针电子设备。本发明使用对测试晶片的直接晶片温度测量来建立作为冷却剂压力的函数的晶片温度行为的数据库,以及根据晶片支撑或“圆盘”的函数来建立晶片温度行为的数据库。温度。然后,在生产晶片的处理期间采用这些数据库,以使晶片温度与所需温度的偏差最小的方式控制冷却剂压力。

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