首页> 外国专利> Halogen free flame retardant epoxy resin composition, flame retardant epoxy resin composition for halogen free build-up multilayer plate, prepreg, copper clad laminate, printed wiring board, copper resin film, carrier resin film, and build Up laminated laminate and build-up multilayer board

Halogen free flame retardant epoxy resin composition, flame retardant epoxy resin composition for halogen free build-up multilayer plate, prepreg, copper clad laminate, printed wiring board, copper resin film, carrier resin film, and build Up laminated laminate and build-up multilayer board

机译：无卤阻燃环氧树脂组合物，用于无卤积层多层板，预浸料，覆铜层压板，印刷线路板，铜树脂膜，载体树脂膜和积层层压层压板和积层的阻燃环氧树脂组合物板

页面导航

摘要
著录项
相似文献

摘要

(1) at least one crosslinked phenoxy phosphazene compound, (b) bispydoxide type epoxy resin, or at least one polyepoxide compound such as (b) bisphenol a type epoxy resin, and (c) bisphenol a type novolak resin; and Halogen free flame retardant epoxy resin composition containing an essential ingredient of the fruit promoting agent and containing 0 to 50 weight% of the inorganic filler.

机译：（1）至少一种交联的苯氧基磷腈化合物，（b）双环氧化合物型环氧树脂，或至少一种聚环氧化合物，例如（b）双酚a型环氧树脂，和（c）双酚a型酚醛清漆树脂;含有水果促进剂的必要成分且含有0〜50重量％的无机填充剂的无卤阻燃环氧树脂组合物。

著录项

公开/公告号JPWO02/006399A1

专利类型
公开/公告日2003-08-26

原文格式PDF
申请/专利权人京セラケミカル株式会社;大塚化学ホールディングス株式会社;
展开▼

申请/专利号JP特願2002-512297(P2002-512297)
发明设计人鈴木鉄秋;風間真一;杉山強;神谷博輝;印牧典子;小川桂;多田祐二;
展开▼

申请日2001-07-16
分类号C08G59/18;B32B15/08;C08G79/02;C08J5/24;C08K3/00;C08K5/5399;C08L63/00;C08L85/02;H05K1/03;H05K3/46;
国家 JP
入库时间 2022-08-22 00:23:05

相似文献

专利
外文文献
中文文献