- IMPROVING MULTI-CHIP MODULE TESTABILITY USING POLED-POLYMER INTERLAYER DIELECTRICS

• 1. 使用极化聚合物层间电介质对多芯片模块可测试性的改进 [P] . 中国专利： CN1137385C . 2004.02.04
• 2. 使用板化聚合物层间电介质对多芯片模块可测试性的改进 [P] . 中国专利： CN1331802A . 2002-01-16
• 3. IMPROVING MULTI-CHIP MODULE TESTABILITY USING POLED-POLYMER INTERLAYER DIELECTRICS [P] . 欧洲知识产权局专利： EP1121602B1 . 2004-04-07

  机译： 使用POLED-聚合物层间介电层改善多芯片模块的可测试性

• 4. IMPROVING MULTI-CHIP MODULE TESTABILITY USING POLED-POLYMER INTERLAYER DIELECTRICS [P] . 欧洲知识产权局专利： EP1121602A1 . 2001-08-08

  机译： 使用POLED-聚合物层间介电层改善多芯片模块的可测试性

• 5. IMPROVING MULTI-CHIP MODULE TESTABILITY USING POLED-POLYMER INTERLAYER DIELECTRICS [P] . 世界知识产权组织专利： WO0022443A1 . 2000-04-20

  机译： 使用POLED-聚合物层间介电层改善多芯片模块的可测试性

• 1. Improving the Interfacial Mechanical Property of Fiber Reinforced Cement with Dielectric Barrier Discharge 1:The Pul - out Test [J] . 丁可, 施芸城, 谢涵坤 东华大学学报：英文版 . 2000,第003期
• 2. Design for Low Power Testing of Computation Modules with Contiguous Subspace in VLSI [J] . Ji-Xue Xiao, Yong-Le Xie, Guang-Ju Chen 中国电子科技：英文版 . 2009,第004期
• 3. AN IMPROVED MODEL OF THE INTERCONNECTION DELAY OF MULTICHIP MODULES [J] . 电子科学学刊：英文版 . 1999,第003期
• 4. New olefinic interlevel dielectric materials for multi-chip modules [C] . Shick, R.A., Goodall, . 1996
• 5. A study of the etching and surface modification characteristics of polyimide films for use as a dielectric layer in multi-chip modules. [D] . Mannarino, Matthew Marchand. 2008
• 6. Thermal Impedance Characterization Using Optical Measurement Assisted by Multi-Physics Simulation for Multi-Chip SiC MOSFET Module [O] . Min-Ki Kim, Sang Won Yoon 2020
• 7. Multi-Chip Modules using etched gold conductors and a high performance low permittivity photosensitive dielectric [O] . 1993

• 1. Design for Low Power Testing of Computation Modules with Contiguous Subspace in VLSI [J] . Ji-Xue Xiao ,Yong-Le Xie ,Guang-Ju Chen . 电子科技学刊 . 2009,第004期
• 2. Improving the Test Tasks to Improve the Authenticity of TEM Listening Sub-tests [J] . Zhengsheng ,Dang . 中美英语教学 . 2005,第012期
• 3. 利用FFT完成聚合物超低频介电频谱的测量 [C] . 张治文 . 电气绝缘性能测试技术与测试仪器学术讨论会 . 1986
• 4. 设置调平层的聚合物改性水泥混凝土路面层间粘结试验研究及计算分析 [A] . 徐晓雷 . 2012