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PBGA package and mother substrate and PBGA package implemental manner null for PBGA package implementation
PBGA package and mother substrate and PBGA package implemental manner null for PBGA package implementation
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机译：PBGA封装及其母基板和PBGA封装的实现方式对于PBGA封装的实现无效
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摘要
PURPOSE: To prevent the connecting failure of a PBGA package to a base board for mounting the package by providing a vent hole passed from the front surface to the rear surface of the package. ;CONSTITUTION: Two vent holes la passed from the front surface to the rear surface of a PBGA package 1 are formed near the center of the package 1. With the structure, at the time of reflow heating, heat is easily transferred to a solder ball electrode 2 formed near the center of the rear surface of the package 1 via the holes 1a. Accordingly, the electrode 2 formed near the center of the rear surface of the package 1 is sufficiently melted. As a result, the connecting failure of a base board for mounting the package can be prevented.;COPYRIGHT: (C)1995,JPO
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