首页> 外国专利> MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone

MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone

机译：MEMS封装，MEMS麦克风，制造MEMS封装的方法及制造MEMS麦克风的方法

页面导航

摘要
著录项
相似文献

摘要

A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the element substrate has an element hole-part which the movable element is arranged. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the element hole-part and a gel member. The gel member is formed by hardening of gel which is applied on the annular dam-member.

机译：MEMS封装具有MEMS芯片，封装基板，损坏密封部分。 MEMS芯片具有元件基板，该元件基板形成可移动元件，元件基板具有可移动元件布置的元件孔部分。该损坏密封部分具有环形挡板构件，其形成在元件基板上，以围绕元件孔部和凝胶构件。凝胶构件是通过在环形挡板构件上施加的凝胶的硬化而形成的。

著录项

公开/公告号US10934159B2

专利类型
公开/公告日2021-03-02

原文格式PDF
申请/专利权人 SAE MAGNETICS (H.K.) LTD.;
展开▼

申请/专利号US201916429132
发明设计人 MASASHI SHIRAISHI;AKIO NAKAO;
展开▼

申请日2019-06-03
分类号B81B7;B81B7/02;B81C1;H04R19/04;
国家 US
入库时间 2022-08-24 17:26:36

相似文献

专利
外文文献
中文文献