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SCALABLE HIGH-PERFORMANCE PACKAGE ARCHITECTURE USING PROCESSOR-MEMORY-PHOTONICS MODULES
SCALABLE HIGH-PERFORMANCE PACKAGE ARCHITECTURE USING PROCESSOR-MEMORY-PHOTONICS MODULES
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机译：使用处理器-内存-光电子模块的可扩展高性能封装体系结构
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摘要
A processor package module comprises a processor-memory stack including one or more compute die stacked and interconnected with a memory stack on a substrate. One or more photonic die is on the substrate to transmit and receive optical I/O, the one or more photonic die connected to the processor-memory stack and connected to external components through a fiber array. The substrate is mounted into a socket housing, such as a land grid array (LGA) socket. An array of processor package modules are interconnected on a processor substrate via fiber arrays and optical connectors to form a processor chip complex.
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