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SCALABLE HIGH-PERFORMANCE PACKAGE ARCHITECTURE WITH PROCESSOR-MEMORY-PHOTONICS MODULES
SCALABLE HIGH-PERFORMANCE PACKAGE ARCHITECTURE WITH PROCESSOR-MEMORY-PHOTONICS MODULES
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机译：具有处理器-内存-光电子模块的可扩展高性能封装体系结构
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摘要
A processor package module includes a processor memory stack including one or more compute dies stacked and connected to a memory stack on a substrate. One or more photonic dies on the substrate for sending and receiving optical I/O, the one or more photonic dies being connected to the processor memory stack and being connected to external components via a fiber array. The substrate is in a socket housing, z. B. an LGA (Land Grid Array) socket attached. On a processor substrate, an array of processor package modules are connected via fiber arrays and optical connectors to form a processor chip complex.
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