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Development and Evaluation of Hermetic CeramicMicrowave Packages for Space Applications

机译:用于太空的密封陶瓷微波封装的开发和评估

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摘要

Within the KERAMIS project (funded by the German Ministry of Education and Technology) a consortium of sixrncompanies, research institutes and universities is developing ceramic based microwave packages for satelliternapplications. Several interface concepts like Ball Grid Array (BGA), Land Grid Array (LGA) and peripheral wirernbond packages are among the candidates to realize microwave compatible connections to other modules or to thernmother board. From a technology point of view the focus is put on fine line resolution and hermeticity. The latter isrnpredominately realized by multilayer LTCC substrates sealed with metal or ceramic lids.rnBased on the specific function of the module, packages with and without metal heat sinks are considered. Therefore,rnthe LTCC substrate itself needs to be hermetic. Several thermal via and transition line configurations have beenrninvestigated in the start phase of the project. Practical results will be demonstrated and design rules are derived.rnThe test matrix contains also lead free materials for frame and heat sink soldering to be compliant with thernEuropean "Restriction of the use of Hazardous Substances" (RoHS). First results of the performance of microwaverntransitions up to 50 GHz will be shown.rnIn addition to the main topic of the paper results of thin film processing for resistors will be given in the paper.
机译:在KERAMIS项目(由德国教育和技术部资助)中,由六家公司,研究机构和大学组成的财团正在开发用于卫星应用的陶瓷基微波封装。几种接口概念,例如球栅阵列(BGA),焊盘栅格阵列(LGA)和外围引线键合封装,都是实现与其他模块或与其他模块的微波兼容连接的候选方案。从技术角度来看,重点放在细线分辨率和密封性上。后者主要通过用金属或陶瓷盖密封的多层LTCC基板来实现。根据模块的特定功能,可以考虑带有或不带有金属散热器的封装。因此,LTCC基板本身需要密封。在项目的开始阶段已经研究了几种热通孔和过渡线的配置。将证明实际结果并推导出设计规则。测试矩阵还包含用于框架和散热器焊接的无铅材料,以符合欧洲的“有害物质使用限制”(RoHS)。将会显示出高达50 GHz的微波转换性能的初步结果。除了论文的主要主题外,还将给出电阻器薄膜处理的结果。

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