首页> 外文会议>2016 5th International Conference on Informatics, Electronics and Vision >Effect of symmetrical underlap length on device performance of a GaN-based double gate MOSFET
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Effect of symmetrical underlap length on device performance of a GaN-based double gate MOSFET

机译:对称的下重叠长度对GaN基双栅MOSFET器件性能的影响

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GaN-based double gate DG-MOSFETs have been designed and simulated in nano-scale regime for future logic-switching applications. To minimize the short-channel effects (SCEs), both gate-to-source (G-S) and gate-to-drain (G-D) lengths, symmetrical underlap length, LUN, have been extended. The underlap architectured-devices exhibit better performance due to reduction of coupling capacitance between the contacts (S-G and G-D). The value of subthreshold slope (SS) and drain induced barrier lowering (DIBL) are 62.897 mV/decade and 33.59 mV/V, respectively for an underlap length, LUN = 8 nm with a gate length, LG = 12 nm.
机译:基于GaN的双栅极DG-MOSFET已在纳米尺度下进行了设计和仿真,以用于未来的逻辑开关应用。为了最小化短沟道效应(SCE),栅极到源极(G-S)和栅极到漏极(G-D)的长度(对称的下重叠长度LUN)都已扩展。由于减小了触点(S-G和G-D)之间的耦合电容,因此底层重叠结构的器件表现出更好的性能。亚阈值斜率(SS)和漏极引起的势垒降低(DIBL)的值分别对应于重叠长度LUN = 8 nm和栅极长度LG = 12 nm的下叠层长度62.897 mV /十倍和33.59 mV / V。

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