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首页> 外文会议>The 38th IMAPS Nordic Annual Conference, Sep 23-26, 2001, Oslo, Norway >Recent Research and Development Trend in Wet Processing of Electronics Packaging Technology in Japan
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Recent Research and Development Trend in Wet Processing of Electronics Packaging Technology in Japan

机译：日本电子封装技术湿加工的最新研究和发展趋势

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1. Optimization of total control from the product planning stage, conversion of the device and package assembly, manufacture, in spection and servicing, including cost (concurrent engineering), is necessary (Integrated computer aided design, computer aided engineering, computer aided manufacturing). 2. Securing of the reliability of electronic devices and parts (Known Good Die, High Reliability Technology). 3. Securing of high-density packaging technology of devices and parts (Chip Size Packaging (CSP), Ball Grid Array (BGA) technology, tape automated bonding (TAB) technology, Flip Chip Connection (FC) technology, Elastic Connection (El. Con.) technology, Bump Formation technology etc.). 4. Development of high-density, low-cost circuit board technology, material and process technologies such as MCM-C, MCM-D, MCL-, and composite function boards. 5. Evolution and progress of concurrent engineering in the design technology of electronic equipment. 6. Advanced development of computer application technology such as CAD, CAE and CIM, and evolution and progress of chip- and board-level technological fusion. 7. Evolution and progress of optimization (cost-reduction greater ease of manufacture, and greater ease of inspection) at each stage, including the stages of MCM technology design, module manufacture, inspection and evaluation, and of shipment and service. 8. Evolution and progress of technologies for decreasing power consumption and improving reliability of electronic devices and parts. 9. Evolution and progress of high-density circuit board technology and micro-connection technology. 10. Expectation for development and application of low-cost cooling technology. 11. Selection and implementation of materials and processes suitable for global environment protection (growing demand for clearness maintenance technology, including product recycling technology). 12. Introduction and development of optical technologies for improvement of material characteristics and solution of wiring problems to meet the demand for electronic equipment high in speed and smaller in size. 13. The WETProcess Technology include the very Wide Technology Range; for example, REACENTRY, very fast growing areas are Electroplating, Electroless Plating, Surface Modification Technology (Adsorption, Chemisorption etc.), Surface Coating Technology (SOL/GEL Process, spin coating, dipping, potting, spray coating etc.), Anodizing Technology, Chemical Wet Polishing, Laser ablasing technology for Wet solution. 14. Recently, in the world wide Technical Conference, Technical Patent and Paper and increase very rapidly. Reason why, Wet Process are very cheap and doesn't need the high cost apparatus (like the vacuum machine) and high level control technology are realized by use the many kind of Analytical Method, Electro chemical method.
机译：1.必须从产品计划阶段，设备和包装组装的转换，制造，检验和维修（包括成本）（并行工程）的制造中优化总体控制（集成计算机辅助设计，计算机辅助工程，计算机辅助制造） 。 2.确保电子设备和零件的可靠性（已知的良好管芯，高可靠性技术）。 3.确保设备和零件的高密度封装技术（芯片尺寸封装（CSP），球栅阵列（BGA）技术，胶带自动粘合（TAB）技术，倒装芯片连接（FC）技术，弹性连接（El。 Con。）技术，凹凸形成技术等）。 4.开发高密度，低成本电路板技术，材料和工艺技术，例如MCM-C，MCM-D，MCL-和复合功能板。 5.电子设备设计技术中并行工程的演进和进展。 6.计算机应用技术（如CAD，CAE和CIM）的先进发展，以及芯片级和板级技术融合的发展和进步。 7.在每个阶段，包括MCM技术设计，模块制造，检查和评估以及运输和服务的阶段，优化的发展和进步（降低成本的过程使制造更容易，检查更容易）。 8.降低功耗，提高电子设备和零件可靠性的技术的发展和进步。 9.高密度电路板技术和微连接技术的发展与进步。 10.对低成本冷却技术的开发和应用的期望。 11.选择和实施适合全球环境保护的材料和工艺（对透明度维护技术（包括产品回收技术）的需求不断增长）。 12.光学技术的引入和发展，以改善材料特性并解决布线问题，以满足对高速，小尺寸电子设备的需求。 13. WETProcess技术包括非常广泛的技术范围；例如，REACENTRY，发展非常迅速的领域是电镀，化学镀，表面改性技术（吸附，化学吸附等），表面涂层技术（SOL / GEL工艺，旋涂，浸涂，灌封，喷涂等），阳极氧化技术，化学湿抛光，湿解决方案的激光烧蚀技术。 14.最近，在世界范围的技术会议上，技术专利和纸件的增长非常迅速。湿法之所以非常便宜且不需要高成本的设备（如真空机）和高级控制技术的原因是通过使用多种分析方法，电化学方法来实现的。

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