Effect of vibration on lead-free solder joint reliability under temperature changes for automotive electronics

机译：温度变化对汽车电子振动对无铅焊点可靠性的影响

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The reliability of lead-free solder balls of Sn-3.5Ag,rnSn-0.7Cu and Sn5.0Sb was evaluated by vibration testsrnunder temperature changes. The materials were used tornfabricate BGA test chips, and those are assembled withrndaisy chain circuit board to prepare the test module.rnRandom vibration was applied under temperature cycle,rnand the resistance of the solder ball was monitored duringrnthe test. Shear strength and microstructure with respect tornIMCs morphologies and thickness were also analyzed. Arnnumerical simulation to obtain the natural frequency andrncorresponding modes were performed to estimate thernfrequency range effect of the random vibration on the testrnmodule. It was found that Sn-0.7Cu exhibited superiorrnmechanical properties among the investigated solderrnmaterials in the present test method.

机译：通过在温度变化下的振动试验，评估了Sn-3.5Ag，rnSn-0.7Cu和Sn5.0Sb无铅焊球的可靠性。该材料用于制造BGA测试芯片，并与菊花链电路板组装在一起以制备测试模块。rn在温度循环下施加随机振动，并在测试过程中监控焊球的电阻。还分析了有关rnIMCs形态和厚度的剪切强度和微观结构。进行数值模拟以获得固有频率，并进行了相应的模态估计，以估计随机振动对测试模块的频率范围影响。发现在本测试方法中，在所研究的焊锡材料中，Sn-0.7Cu表现出优异的机械性能。

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来源
《42nd international symposium on microelectronics (IMAPS 2009)》|2009年|p.215-219|共5页
会议地点 San Jose CA(US);San Jose CA(US)
作者
Sehoon Yoo; Y.K. Sa; Yeong K. Kim; Sanghyun Kwon; ChangWoo Lee;
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作者单位

Micro-Joining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon yoos@kitech.re.kr;

rnMicro-Joining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon;

rnKorea Aerospace University, 100, Hanggongdae Gil, Hwajeon-Dong, Deogyang-Gu, Goyang-city, Gyeonggi-Do;

rnMicro-Joining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon;

rnMicro-Joining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon;

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原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
关键词
lead-free solder; high temperature vibration; reliability; joint properties; automotive;

机译：无铅焊料;高温振动;可靠性;接头性能;汽车;

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专利

1. Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics [J] . Choi Kyeonggon, Yu Dong-Youl, Ahn Sungdo, Microelectronics & Reliability . 2018,第JULa期

机译：汽车电子在恶劣振动条件下各种无铅焊料的联合可靠性
2. Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints [J] . Xinmeng Zhai, Yuefeng Li, Jun Zou, Journal of Electronic Materials . 2021,第3期

机译：焊接温度对Sn-Ag-Cu无铅焊点可靠性的影响
3. Evaluation of the Characteristics of 305SAC Lead-Free Solder Joints between a Chip Electrode and a Cu-Pad in Automotive Electronics [J] . Kang Min-Soo, Jeon Yu-Jea, Kim Do-Seok, International Journal of Precision Engineering and Manufacturing . 2015,第12期

机译：汽车电子中片状电极与Cu-Pad 305SAC无铅焊点特性的评估
4. Effect of vibration on lead-free solder joint reliability under temperature changes for automotive electronics [C] . Sehoon Yoo, Y. K. Sa, Yeong K. Kim, International Symposium on Microelectronics . 2009

机译：振动对汽车电子温度变化下无铅焊点可靠性的影响
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子设备中无铅焊点的可靠性问题
7. Preparation of Lead-free Composite Powder Solder Paste and Study on Reliability of Lead-free Solder Joint [O] . 王建 2012

机译：无铅复合粉末焊锡膏的制备及无铅焊点可靠性研究

Effect of vibration on lead-free solder joint reliability under temperature changes for automotive electronics

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