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首页> 外文会议>42nd international symposium on microelectronics (IMAPS 2009) >The Challenge in Packaging Microelectronics and Optoelectronics
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The Challenge in Packaging Microelectronics and Optoelectronics

机译：包装微电子学和光电学的挑战

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The bandwidths needed for military tactical aircraft mission systems mandate the use of fiber optic interconnects.rnWithout these optical interconnects system capability would be degraded due to the Size, Weight and Powerrn(SWaP) burden of electrical interconnects versus optical interconnects. However, along with the many benefits ofrnfiber optic based communication (bandwidth, weight, EMI immunity, scalability, protocol independence, etc.) comernunique microelectronics and optoelectronics packaging challenges. Connecting the optical chips that perform thernelectrical‐to‐optical (laserdiodes) and optical‐to‐electrical (photodiodes) conversion to the system require uniquerndesign considerations. Additionally, these designs depend on materials and process steps that address the opticalrncoupling requirements that are beyond what is necessary for electrical designs. This paper will describe a militaryrnqualified multimode multi‐channel optical transceiver design that has been fielded in military tactical missionrnsystems and how the design compares and contrasts to non‐optical microelectronics designs.
机译：军事战术飞机任务系统所需的带宽要求使用光纤互连。如果没有这些光学互连，由于电互连相对于光学互连的尺寸，重量和功率（SWaP）负担，系统能力将降低。但是，伴随着基于光纤的通信带来的诸多好处（带宽，重量，EMI抗扰性，可扩展性，协议独立性等）也给微型电子和光电封装带来了挑战。将执行光电转换（光电二极管）和光电转换（光电二极管）的光学芯片连接到系统需要独特的设计注意事项。此外，这些设计取决于满足光学耦合要求的材料和工艺步骤，这些要求超出了电气设计所必需的范围。本文将介绍一种已在军事战术任务系统中应用的符合军方标准的多模多通道光收发器设计，以及该设计如何与非光学微电子设计进行比较和对比。

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