Stepper-based integrated process on wafer pieces

机译：基于步进的晶圆片集成工艺

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High-cost compound semiconductors involve complicated technological development. Using pieces of a whole wafer allows performing the R&D process in a cost-effective way. We developed a method for the processing a piece of wafer using standard manufacturing equipment This method provides the benefits of high-resolution and superior alignment capability of a stepper with the low-cost advantages of working with wafer pieces that normally cannot be exposed in a stepper. This article describes what we do in order to allow processing of mounted InP piece in regular FAB equipment.

机译：高成本的化合物半导体涉及复杂的技术开发。使用整个晶片的片允许以经济有效的方式执行研发过程。我们开发了一种使用标准制造设备处理晶片的方法，该方法具有步进器的高分辨率和优异的对准能力，并具有处理通常无法在步进器中曝光的晶片片的低成本优势。。本文介绍了我们的工作，以便允许在常规FAB设备中处理已安装的InP件。

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来源
《Annual International Conference on Compound Semiconductor MANufacturing TECHnology(CS MANTECH); 20050411-14; New Orleans,LA(US)》|2005年|P.253-256|共4页
会议地点 New OrleansLA(US)
作者
A. Cohen-Nov; V. Krasniansky; G. Bunin; J. Kaplun; L.Ortenberg; R. Ben-Or;
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作者单位

Gal-El(MMIC), P.O. Box 330, Ashdod 77102, Israel;

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会议组织
原文格式 PDF
正文语种 eng
中图分类半导体技术;
关键词
pieces; wafer fragments; stepper; permanent mounting; InP;

机译：零件；晶片碎片；步进；永久安装； InP;

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机译：打开装有25个300毫米晶圆制造工艺的前开式统一容器（FOUP）的门而引起的颗粒浓度动态分析
2. Wafer-scale processing technology for monolithically integrated GaSb thermophotovoltaic device array on semi-insulating GaAs substrate [J] . Jung Min Kim, Partha S Dutta, Eric Brown, Semiconductor science and technology . 2013,第6期

机译：半绝缘GaAs衬底上单片集成GaSb热光电器件阵列的晶圆级加工技术
3. Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology [J] . Advanced Packaging, IEEE Transactions on . 2010,第2期

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4. Stepper-based integrated process on wafer pieces [C] . A. Cohen-Nov, V. Krasniansky, G. Bunin, Annual International Conference on Compound Semiconductor MANufacturing TECHnology . 2005

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5. A WAFER-SCALE BOUNDARY VALUE INTEGRATED CIRCUIT ARCHITECTURE (PARALLEL PROCESSING, FINITE DIFFERENCE, TWO-DIMENSIONAL). [D] . DELGADO-FRIAS, JOSE GUADALUPE. 1986

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Stepper-based integrated process on wafer pieces

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