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首页> 外文会议>Asia Pacific Conference on Optics Manufacture; 20070111-13; Hongkong(CN) >Frequency Spectrum Features of Material Removal Function in Optical Manufacturing
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Frequency Spectrum Features of Material Removal Function in Optical Manufacturing

机译：光学制造中材料去除功能的频谱特征

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摘要

This paper proposes a novel wheel-shaped grinding/polishing tool, which is designed to be controlled on both the self-rotation around its axis and the co-rotation around vertical axis Z at the specified speeds respectively. Therefore, the surface material of the workpiece can be removed by virtue of self-rotating motion. On the other hand, the co-rotating motion will also change the manufacturing orbit continually. To analyze the characteristics of the tool, material removal in the manufacturing zone on the workpiece surface is first established through theoretical modeling. Subsequently, a good evaluating method, i.e. power spectral density, for analyzing the frequency spectrum features of material removal function in computer-controlled optical grinding and polishing is introduced in detail. By simulation, the power spectral density of the material removal function was cut into several parts, some frequency with low amplifies of material removal function were removed, and the modified material removal function reflected the actual processing status, which was helpful in removing some residual high frequency errors on the surface of the workpiece. Finally, the high amplitude such as at high frequency of 110mm~(-1) and 210mm~(-1) was reserved and some other low amplitude frequencies were removed.
机译：本文提出了一种新颖的轮形研磨/抛光工具，该工具设计为分别以指定速度控制绕其轴的自转和绕垂直轴Z的同向旋转。因此，工件的表面材料可以通过自转运动去除。另一方面，同向旋转运动还将连续改变制造轨道。为了分析工具的特性，首先通过理论建模建立工件表面制造区域中的材料去除。随后，详细介绍了一种很好的评估方法，即功率谱密度，用于分析计算机控制的光学研磨和抛光中材料去除功能的频谱特征。通过仿真，将材料去除功能的功率谱密度切成几部分，去除了一些低频率的材料去除功能放大倍数，修改后的材料去除功能反映了实际的加工状态，有助于去除一些残留的高工件表面的频率误差。最后，保留了高振幅，例如在110mm〜（-1）和210mm〜（-1）的高频率，并去除了其他一些低振幅频率。

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