STRESS-FREE COPPER PLANARIZATION USING A MODIFIED ELECTROCHEMICAL SYSTEM

机译：使用改进的电化学系统的无应力铜平面化

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An understanding of electroplanarization (ECP) mechanisms suggests that ECP efficiency is surface pattern dependent. Sharp surface undulations are readily planarized while gentle undulations are more difficult to planarize. An optimized ECP system as discussed in this article, enables anodic dissolution to occur under two different conditions: the dissolution of protruding areas under dynamic (or ohmic) condition; the dissolution of recess areas under mass transport condition. In this way, pattern-independent planarization can be achieved.

机译：对电平面化（ECP）机制的理解表明，ECP效率取决于表面图案。尖锐的表面起伏很容易被平坦化，而平缓的起伏更难以被平坦化。本文讨论的一种经过优化的ECP系统可以使阳极溶解在两种不同的条件下发生：在动态（或欧姆）条件下突出区域的溶解；大众运输条件下凹陷区域的溶解。以这种方式，可以实现与图案无关的平坦化。

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《CMP-MIC Catalog no.05 IMIC - 1000P; International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference(CMP-MIC); 20050223-25; Fremont,CA(US)》|2005年|P.277-283|共7页
会议地点 FremontCA(US)
作者
Jinshan Huo; James McAndrew;
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作者单位

Electronics RD Group, Air Liquide 5230 S. East Avenue, Countryside, Illinois 60525, USA;

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原文格式 PDF
正文语种 eng
中图分类 TM23;
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