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首页> 外文会议>CMP-MIC Catalog no.05 IMIC - 1000P; International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference(CMP-MIC); 20050223-25; Fremont,CA(US) >Effect of Barrier Slurry Properties on Post-CMP Cleaning Efficacy
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Effect of Barrier Slurry Properties on Post-CMP Cleaning Efficacy

机译：阻挡浆料特性对CMP后清洗效率的影响

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摘要

The use of different barrier slurries for copper chemical mechanical penalization (CMP) creates a challenge for post-CMP cleaning. Differences in barrier slurries include, but are not limited to, pH, the abrasive particle material and size, and copper corrosion inhibitor(s). Cleaning tests were conducted to observe the interaction between the barrier slurry and the cleaning process. The barrier slurries differed in pH and all contained benzotriazole (BTA) as a copper inhibitor. The pH of a solution containing BTA will determine the properties of the BTA-Cu complex and the subsequent conditions for removing this film in the cleaning process. Therefore, the cleaning process was varied to study the effect of pH, chemical components, and chemical sequence on the removal of the BTA-Cu complexes left by the barrier slurry on copper surfaces. It was found that the pH of the barrier slurry did affect the efficacy of various cleaners. Also, the use of certain additives and 2-step chemical cleaning unproved cleaning performance on barrier slurries of varying pH. The results of this work indicate that, for optimum results, the cleaning process should be tuned to the barrier slurry.
机译：在铜化学机械罚分（CMP）中使用不同的阻挡浆对CMP后清洗提出了挑战。阻挡浆的差异包括但不限于pH，磨料颗粒的材料和尺寸以及铜腐蚀抑制剂。进行清洁测试以观察阻挡浆料与清洁过程之间的相互作用。隔离液的pH值不同，并且全部包含苯并三唑（BTA）作为铜抑制剂。含有BTA的溶液的pH值将决定BTA-Cu络合物的特性以及在清洁过程中去除该膜的后续条件。因此，改变清洗工艺以研究pH，化学成分和化学顺序对去除阻挡浆在铜表面上留下的BTA-Cu络合物的影响。已经发现，阻挡浆料的pH确实影响了各种清洁剂的功效。同样，使用某些添加剂和两步化学清洗还无法证明对各种pH值的隔离浆料的清洗性能。这项工作的结果表明，为了获得最佳结果，应将清洁过程调整为阻隔浆料。

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