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首页> 外文会议>Conference on Advanced Fabrication Technologies for Micro/Nano Optics and Photonics; 20080121-23; San Jose,CA(US) >Metallo-dielectric nanophotonic materials via direct laser writing and electroless metallization
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Metallo-dielectric nanophotonic materials via direct laser writing and electroless metallization

机译：通过直接激光写入和化学镀金属的金属介电纳米光子材料

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摘要

Interest in three-dimensional (3D) metallo-dielectric photonic crystals (MDPCs) has grown considerably given their potential applications in optics and photonics. MDPCs can exhibit intriguing and potentially useful optical properties, including ultra-wide photonic bandgaps, engineered thermal emission, and negative refractive index. Yet experimental studies of such materials remain few because of the difficulties associated with fabricating 3D micron- and sub-micron-scale metallic structures. We report a route to MDPCs based on metallization of a 3D polymeric photonic crystal (PC) fabricated by multi-photon microfabrication (MPM). Polymeric PCs having face-centered tetragonal symmetry and micrometer-scale periodicity were created using a cross-linkable acrylate or epoxide pre-polymer. The resulting PCs were metallized by electroless deposition of silver or copper. Analysis of the metallized structures in cross-section by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy shows that silver deposited conformally onto the entire micro-porous lattice. The dielectric and metallized PCs were characterized by Fourier transform infrared (FTIR) spectroscopy. The polymer photonic crystals exhibit a stop band with strong reflectance near 4 to 6 microns, depending upon the lattice period. In contrast, FTIR spectra of the metallized PCs show widened stop bands of nearly 6 microns and greater and maximum reflectance exceeding 90%. The appreciable broadening of the stop band due to the presence of the deposited metal is a result consistent with previously reported theoretical and experimental data for all-metallic 3D PCs. Thus, the approach reported here appears suitable for fabricating 3D MDPCs of many symmetries and basis sets and provides a path for integrating such structures with other micron-scale optical elements.
机译：考虑到其在光学和光子学中的潜在应用，人们对三维（3D）金属介电光子晶体（MDPC）的兴趣已大大增加。 MDPC可能表现出有趣且潜在有用的光学特性，包括超宽光子带隙，工程热发射和负折射率。然而，由于与制造3D微米和亚微米级金属结构相关的困难，此类材料的实验研究仍然很少。我们报告了基于通过多光子微加工（MPM）制造的3D聚合物光子晶体（PC）的金属化，通往MDPC的路线。使用可交联的丙烯酸酯或环氧化物预聚物制成具有面心四方对称性和微米级周期性的聚合物PC。通过化学沉积银或铜对所得PC进行金属化。通过扫描电子显微镜（SEM）和能量色散X射线光谱法对横截面中的金属化结构进行分析，结果表明银保形地沉积在整个微孔晶格上。通过傅立叶变换红外（FTIR）光谱对介电和金属化PC进行了表征。取决于晶格周期，聚合物光子晶体显示出在4至6微米附近具有强反射率的阻带。相反，金属化PC的FTIR光谱显示出将近6微米或更宽的阻带，并且最大反射率超过90％。由于存在沉积的金属而导致的阻带明显变宽是与先前报道的全金属3D PC的理论和实验数据一致的结果。因此，此处报道的方法似乎适合于制造具有许多对称性和基本集的3D MDPC，并提供了将此类结构与其他微米级光学元件集成在一起的途径。

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