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首页> 外文会议>Conference on Challenges in Process Integration and Device Technology 18-19 September 2000 Santa Clara, USA >Is lithography ready for 300mm?
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Is lithography ready for 300mm?

机译：光刻准备好300毫米了吗？

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摘要

SEMCONDUCTOR300 was the first pilot production facility for 300 mm wafers in the world. This company, a joint venture between infineon technologies and Motorola, started in early 1998 to develop processes and manufacture products using 300mm wafer tool set. The lithography tools include I-line steppers, an I-line scanner, a DUV stepper, and DUV scanners. All of these exposure tools are running in-line with a photoresist coat and develop track. The lithography tools are used to build 64Mb DRAM devices and aggressive test vehicles with design rules of 0.25 umm and below, in sufficient quantity to be able to assess the tool readiness. This paper presents the history of technical improvements and roadblocks that have occurred on the 300mm lithography tool set since the start-up, and describe a methodology used to assess the tool performance.
机译：SEMCONDUCTOR300是世界上首个300 mm晶圆试生产设备。这家公司是英飞凌技术公司和摩托罗拉之间的合资企业，于1998年初开始使用300mm晶圆工具套件开发工艺和制造产品。光刻工具包括I线步进器，I线扫描器，DUV步进器和DUV扫描器。所有这些曝光工具都与光刻胶涂层串联运行并显影。光刻工具用于构建64Mb DRAM器件和设计规则为0.25 umm及以下的侵蚀性测试车，其数量足以评估工具的准备情况。本文介绍了自启动以来300mm光刻工具集发生的技术改进和障碍的历史，并描述了用于评估工具性能的方法。

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