首页> 外文会议>Conference on Challenges in Process Integration and Device Technology 18-19 September 2000 Santa Clara, USA >Prospective Technology for System-on-a-Chip: N_2 implant followed by VHP O_2 re-oxidation
【24h】

Prospective Technology for System-on-a-Chip: N_2 implant followed by VHP O_2 re-oxidation

机译:片上系统的预期技术:N_2注入,然后VHP O_2再氧化

获取原文
获取原文并翻译 | 示例

摘要

A novel technique - N_2 ion implant (N_2 I/I) followed by vertical high pressure (VHP) O_2 re-oxidation in a furnace, capable of growing oxides of multiple thickness is presented. It is observed that the oxidation rate can be well modulated by varying the N_2 I/I dose, and VHP O_2 re-oxidation provides enhanced oxide growth rate and controls the ntrogen profile in the film, as compared to RTO or furnace O_2 re-oxidation. Therefore, more than 500
机译:提出了一种新颖的技术-N_2离子注入(N_2 I / I),然后在炉中进行垂直高压(VHP)O_2再氧化,能够生长多种厚度的氧化物。可以观察到,通过改变N_2 I / I剂量可以很好地调节氧化速率,与RTO或炉子O_2的再氧化相比,VHP O_2的再氧化可以提高氧化物的生长速率并控制薄膜中的氮素分布。 。因此,超过500

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号