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Hard Pellicle Study for 157-nm Lithography

机译:157 nm光刻的硬质膜研究

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Identifying a functional pellicle solution for 157-nm lithography remains the most critical issue for mask technology. Developing a hard pellicle system has been a recent focus of study. Fabrication and potential pellicle-induced image placement errors present the highest challenges to the technology for meeting the stringent error budget for manufacturing devices in the 65-nm regime. This paper reports the results of a comprehensive proof-of-concept study on the state-of-art hard pellicle systems, which feature 800-μm thick modified fused silica pellicles and quartz frames. Pellicles were fabricated to ensure optical uniformity and flatness. Typical intrinsic warpage of these pellicles was close to the theoretical limit of 4.0 μm under a gravitational load. Quartz frames had bows less than 1.0 μm. The advantage of quartz frames with matched thermal expansion was demonstrated. An interferometric facility was developed to measure the flatness of the mask and pellicle system before and after pellicle mounting. Depending on the mounting process as well as mounting tool characteristics and techniques, variations were observed from pellicle to pellicle, mount to mount, and mask to mask. A redesign of the mounter and mounting process has significantly improved pellicle flatness. Finite element models were also generated to characterize the relative importance of the principal sources of pellicle-induced photomask distortions. Simulation results provide insightful guidance for improving image quality when employing a hard pellicle.
机译:确定用于157 nm光刻的功能防护膜解决方案仍然是掩模技术最关键的问题。开发硬膜系统是最近的研究重点。制造和潜在的薄膜引发的图像放置错误为满足65纳米制程中制造设备的严格错误预算要求,对该技术提出了最高挑战。本文报告了对最先进的硬防护系统的概念验证的综合研究结果,该系统具有800μm厚的改性熔融石英防护膜和石英框架。制造小球以确保光学均匀性和平坦度。这些薄膜的典型固有翘曲在重力载荷下接近理论极限4.0μm。石英镜框的弓度小于1.0μm。展示了具有匹配热膨胀的石英框架的优点。开发了一种干涉测量设备,用于在安装薄膜组件之前和之后测量面罩和薄膜组件的平面度。根据安装过程以及安装工具的特性和技术,观察到薄膜之间的差异,安装到安装以及掩模到掩模的变化。贴片机和贴片工艺的重新设计显着提高了薄膜的平整度。还生成了有限元模型来表征薄膜防护膜引起的光掩模变形的主要来源的相对重要性。仿真结果为使用硬质薄膜时提高图像质量提供了有见地的指导。

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