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Failure prediction across process window for robust OPC

机译：跨过程窗口的故障预测可实现强大的OPC

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摘要

In conventional Optical and Process Correction (OPC), models are calibrated with the CD measurement from the "good" printable patterns. Predictions of process window loss are based on extrapolation from the "good" region into the failure region. The extrapolation is always a less accurate process than interpolation. In this paper, we utilize the experimental pass/fail data to build models that accurately identify and predict printing failures. We developed a methodology and a formal apparatus for failure modeling. It is found that two or more aerial image shape parameters are required to describe all failure mechanisms for a sub-100nm process. This empirical failure model is currently applied to Optical Rule Checking (ORC) of the post-OPC layout. It also can be used to constrain layout corrections in the future.
机译：在常规的光学和过程校正（OPC）中，通过CD测量从“良好”可打印图案中对模型进行校准。过程窗口损失的预测基于从“良好”区域到故障区域的推断。外推总是比内插精度差的过程。在本文中，我们利用实验的通过/失败数据来建立模型，以准确地识别和预测打印失败。我们开发了一种用于故障建模的方法论和正式的工具。发现需要两个或多个航拍图像形状参数来描述100nm以下工艺的所有失效机理。此经验失败模型当前应用于后OPC布局的光学规则检查（ORC）。将来也可以用于约束布局更正。

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