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The Introduction of Tensile Ratcheting in Solder Bumps Encapsulated in Low Tg Underfill

机译：在低Tg底部填充胶中封装的焊球中拉伸棘轮的介绍

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摘要

The effects of low Tg underfill material on the reliability of high-Pb first levelrninterconnects were assessed through elastic-plastic finite element modeling andrninspection of failure sites at the first-level interconnect. Temperature-dependent changesrnin specific underfill parameters (elastic modulus and coefficient of thermal expansion)rninduced a primary tensile stress within the solder bump. The presence and magnitude ofrnthis tensile stress were highly dependent upon the maximum and minimum temperaturernof exposure. Under certain specific thermal conditions, a form of tensile ratcheting wasrnidentified through finite element modeling.rnThe application of tensile stress was found to induce a change in degradation behaviorrnand rates relative to the nominal shear stress state (see Figure). This effectivelyrneliminated distance-to-neutral point as a predictor of first-level interconnectsrnperformance and required the development of new models to predict solder bumprnbehavior. A discussion on this transformation in stress states and the potential influencernon changes in part qualification procedures are provided.
机译：通过弹塑性有限元建模和一级互连失效点的检查，评估了低Tg底部填充材料对高Pb一级互连的可靠性的影响。特定底部填充参数（弹性模量和热膨胀系数）随温度的变化会引起焊料凸点内的主要拉伸应力。该拉伸应力的存在和大小在很大程度上取决于最大和最小暴露温度。在某些特定的热条件下，通过有限元建模确定了一种张紧棘轮的形式。rn发现，施加张应力会导致相对于标称剪应力状态的降解行为和速率发生变化（见图）。这有效地消除了距中性点的距离，从而可以预测一级互连的性能，并需要开发新的模型来预测焊料的凸点行为。讨论了应力状态的这种转变以及零件鉴定程序中潜在影响因素的变化。

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  • 来源
    《Device packaging 2010》|2010年|p.1|共1页
  • 会议地点 Scottsdale/Fountain Hills AZ(US)
  • 作者

    Craig D. Hillman; Randy Schueller; Greg Caswell;

  • 作者单位

    DfR Solutionsrn5110 Roanoke PlacernCollege Park, MD 20740rnP: 301-474-0607rnE: chillman@dfrsolutions.com;

    DfR Solutionsrn5110 Roanoke PlacernCollege Park, MD 20740;

    DfR Solutionsrn5110 Roanoke PlacernCollege Park, MD 20740;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 制造工艺;
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