The Fabrication of Composite Solder by Addition of Copper Nano Powder into Sn-3.5Ag Solder

机译：Sn-3.5Ag钎料中添加铜纳米粉制备复合钎料

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Copper nano powder was incorporated into Sn-3.5Ag solder at 3wt%, by mechanically alloyed (MA) by ball milling in a planetary ball mill at room temperature. The rotation speed was kept constant at 150 rpm with different milling time, 26 hours, 78 hours and 120 hours. The milled solder was mixed with flux and reflowed at 240℃ for 60 seconds. XRD result confirmed the formation of Cu3Sn after 120 hours of milling time. The melting temperature of the samples decreased as a function of milling time. The wetting angle was improved by 48% for the composite solder Sn-3.5Agnano-3.0Cu for 120 hours ball milled, compared to the Sn3.5Ag solder. Increased of hardness was obtained as a result of incorporation of nanoparticle.

机译：通过在室温下在行星式球磨机中通过球磨机械合金化（MA），将铜纳米粉以3wt％的量掺入Sn-3.5Ag焊料中。在不同的研磨时间，26小时，78小时和120小时下，转速保持恒定在150rpm。将经过研磨的焊料与助焊剂混合，并在240℃下回流60秒。 XRD结果证实了120小时的研磨时间后形成了Cu3Sn。样品的熔化温度随研磨时间而降低。与Sn3.5Ag焊料相比，球磨120小时的Sn-3.5Agnano-3.0Cu复合焊料的润湿角提高了48％。由于掺入了纳米颗粒，所以硬度增加了。

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来源
《Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09》|2009年|607-610|共4页
会议地点 Beijing(CN)
作者
Aemi Nadia;
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作者单位

University Malaya Mech Engineering, University Malaya, 50603 KL, Malaysia;

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原文格式 PDF
正文语种 eng
中图分类包装工程;
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专利

1. Integrating copper at the nanometer length scale with Sn-3.5Ag solder to develop high performance nanocomposites [J] . P. Babaghorbani, M. L. Nai, M. Gupta Materials Science and Technology: MST: A publication of the Institute of Metals . 2009,第10期

机译：将纳米级的铜与Sn-3.5Ag焊料集成在一起以开发高性能的纳米复合材料
2. Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing [J] . F. Gao, T. Takemoto, H. Nishikawa Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing . 2006,第1a2期

机译：添加Co和Ni对Sn-3.5Ag焊料和Cu在焊接和退火过程中反应扩散的影响
3. Effects of addition of copper particles of different size to Sn-3.5Ag solder [J] . Aemi Nadia, A. S. M. A. Haseeb Journal of materials science . 2012,第1期

机译：Sn-3.5Ag焊料中添加不同尺寸的铜颗粒的影响
4. The fabrication of composite solder by addition of copper nano powder into Sn-3.5Ag solder [C] . International Conference on Electronic Packaging Technology High Density Packaging . 2009

机译：通过将铜纳米粉末加入SN-3.5AG焊料中的复合焊料制造
5. Metallurgical investigation of silver-copper-tin lead-free solder with the addition of gold. [D] . Kabade, Rajendra R. 2003

机译：含金的银铜锡无铅焊料的冶金学研究。
6. Spatiotemporal Modeling of Laser Tissue Soldering Using Photothermal Nanocomposites [O] . Madaline Mushaben, Russell Urie, Tanner Flake, -1

机译：使用光热纳米复合材料的激光组织焊接时空建模
7. Characterization Of Creep Behaviours Of Soldered Joints Of A Nano-Composite Solder And Of Lead-Free Sn-Ag-Bi And Sn60Pb40 Solders [O] . Zhang X. P., Mai Y. W., Shi Y. W., 2004

机译：纳米复合焊料和无铅Sn-Ag-Bi和Sn60Pb40焊料的焊接接头的蠕变行为的表征
8. SOLDERING OF COPPER-CLAD NIOBIUM-TITANIUM SUPERCONDUCTOR COMPOSITE [R] . A. J. Moorhead, J. J. Woodhouse, D. S. Easton 1977

机译：铜 - 铌 - 钛 - 钛超导体复合材料的焊接

The Fabrication of Composite Solder by Addition of Copper Nano Powder into Sn-3.5Ag Solder

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