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首页> 外文会议>EPP-vol.6; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US) >AN EXPERIMENTAL STUDY OF LEAD-FREE WAVE SOLDERING USING SAC 305 AND NO-CLEAN FLUX
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AN EXPERIMENTAL STUDY OF LEAD-FREE WAVE SOLDERING USING SAC 305 AND NO-CLEAN FLUX

机译：利用SAC 305和无清洁通量进行无铅波峰焊接的实验研究

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The transition to lead-free assembly will have a significant effect on wave soldering operations. Since the wetting ability of lead-free solder is usually less than that of tin-lead solder, it can result in unacceptable hole fills and inconsistent top side wetting - especially in the case of thick Printed Circuit Boards (PCBs). Presently, there is very little data available on lead-free wave soldering with tin-silver-copper (SnAgCu or SAC) alloy and no-clean flux chemistry. Although some researchers and consortia recommend tin-copper (SnCu) for lead-free wave soldering, demonstrating the feasibility of using the SAC alloy for wave soldering operation can aid manufacturers to use the same alloy for both reflow and wave soldering operations. In this study, SAC 305 alloy and no-clean flux were evaluated in terms of percentage of hole fill and solderability on a 93 mil thick test vehicle with Immersion Silver (ImmAg) surface finish. The evaluation was performed on a nitrogen equipped wave soldering equipment. It has 4 preheating zones (3 convection bottom heaters and 1 infrared top heater) that provides good control to develop the required preheat profile. A partial factorial experiment was conducted to study the main effects of solder pot temperature, topside preheat temperature and conveyor speed on wave soldering performance. Wave soldering was performed after two reflow cycles. A 100% visual inspection was done for all the through hole components using a 10X microscope to determine top side wetting, percentage of hole fill, bridging, flux residue and solder balling. Thickness of the hole fill was also measured using digital X-Ray equipment. The data generated from this experiment was used to determine the 'optimum' lead-free process parameters for wave soldering using a SAC 305 alloy with a no-clean flux chemistry. The 'optimized' process parameters were then used to evaluate boards with Organic Solderability Protective (OSP) and Electroless Nickel Immersion Gold (ENIG) surface finishes. The designed experiments approach adopted to determine the optimum process settings and the research findings are explained in detail.
机译：向无铅组装的过渡将对波峰焊操作产生重大影响。由于无铅焊料的润湿能力通常小于锡铅焊料的润湿能力，因此会导致不可接受的孔填充和不一致的顶部润湿性，尤其是在厚印刷电路板（PCB）的情况下。目前，关于锡-银-铜（SnAgCu或SAC）合金的无铅波峰焊以及免清洗助焊剂化学的数据很少。尽管一些研究人员和协会建议锡铜（SnCu）用于无铅波峰焊，但证明将SAC合金用于波峰焊操作的可行性可以帮助制造商将相同的合金用于回流焊和波峰焊操作。在这项研究中，SAC 305合金和免清洗助焊剂是在93 mil厚的具有沉银（ImmAg）表面光洁度的测试载具上，根据孔填充百分比和可焊性进行评估的。评估是在配备氮气的波峰焊接设备上进行的。它具有4个预热区（3个对流底部加热器和1个红外顶部加热器），可以很好地控制以开发所需的预热曲线。进行了部分析因实验，以研究锡锅温度，顶部预热温度和传送带速度对波峰焊接性能的主要影响。在两个回流周期后进行波峰焊。使用10倍显微镜对所有通孔组件进行100％视觉检查，以确定顶侧润湿，孔填充百分比，桥接，助焊剂残留和焊球。孔填充物的厚度也使用数字X射线设备测量。该实验产生的数据用于确定使用带有免清洗助焊剂化学成分的SAC 305合金进行波峰焊接的“最佳”无铅工艺参数。然后，将“优化的”工艺参数用于评估具有有机可焊性保护（OSP）和化学镍浸金（ENIG）表面处理的电路板。详细说明了用于确定最佳工艺设置和研究结果的设计实验方法。

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