• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>EuSPEN(European Society for Precision Engineering and Nanotechnology) International Conference; 20040531-0602; Glasgow(GB) >Adaptive tools with integrated piezoelectric actuators and sensors
【24h】

Adaptive tools with integrated piezoelectric actuators and sensors

机译：带有集成压电致动器和传感器的自适应工具

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

An active piezo-controlled carrier for CMP of wafers was developed. It uses several, by means of piezo-stacks individually controllable rings. The carrier is optimized regarding its stiffness and reliability by means of three-dimensional finite element calculations. The high stiffness and positioning accuracy of the system allows the exact control of different surface profiles and thus the purposeful attitude of the pressure and removal profile independently of the polishing pressure. Tests show a very homogeneous pressure and removal distribution in the circumference of the wafer. The concept is transferable on further wafer diameters, whereby the width of the individual zones can be widely adapted to the requirements of the demanded removal profile. Results of finite element analysis for a 12" prototype are available. The variable concept allows to upgrade existing CMP machines. The aims of current developments are the integration of online-pressure measuring techniques to control the process, wireless transfer of energy and data into the carrier and the local control of the removal profile.
机译：开发了一种用于晶片CMP的有源压电控制载体。它通过压电堆栈分别控制的环使用多个环。借助三维有限元计算，优化了载体的刚度和可靠性。该系统的高刚度和定位精度允许对不同的表面轮廓进行精确控制，从而使压力和去除轮廓的目标姿态独立于抛光压力。测试表明，晶片圆周上的压力和去除量分布非常均匀。该构思可在另外的晶片直径上转移，由此各个区域的宽度可以广泛地适应所需的去除轮廓的要求。可获得12英寸原型机的有限元分析结果。可变概念允许升级现有CMP机器。当前开发的目标是集成在线压力测量技术以控制过程，将能量和数据无线传输到设备中。载体和移除配置文件的本地控制。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号