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Polycrystalline Germanium and Silicon-Germanium Alloys on Plastic for Realization of Thin-Film Transistors

机译:塑料上的多晶锗和硅锗合金,用于实现薄膜晶体管

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Device-quality polycrystalline Ge layers have been grown on flexible poly-ethylene terephthalate (PET) substrates by means of stress-assisted Cu-induced crystallization at temperatures as low as 130℃ and employed for fabrication of depletion-mode poly-Ge thin-film transistors (TFTs). These TFTs show an ON/OFF ratio of 104 and an effective hole mobility of 110 cm~2/Vs. The stress-assisted crystallization technique has been extended to crystallize SiGe alloys at low temperatures for possible fabrication of poly-SiGe TFTs on plastic. As a result, poly-Ge seeded poly-crystalline SiGe layers with 40% Si content are grown at a low annealing temperature of 180℃ in the presence of 0.05% equivalent compressive strain.
机译:通过在低至130℃的温度下通过应力辅助Cu诱导的结晶,在柔性聚对苯二甲酸乙二酯(PET)衬底上生长了器件质量的多晶Ge层,并用于制造耗尽型多Ge薄膜晶体管(TFT)。这些TFT的开/关比为104,有效空穴迁移率为110 cm〜2 / Vs。应力辅助结晶技术已经扩展到可以在低温下结晶SiGe合金,从而可以在塑料上制造聚SiGe TFT。结果,在0.05%当量压缩应变的情况下,在180℃的低退火温度下生长了具有40%Si含量的多Ge籽晶多晶SiGe层。

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