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首页> 外文会议>Fracture and strength of solids VII >The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging
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The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging

机译：减少倒装芯片封装固化时间的底部填充环氧树脂硬度的研究

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摘要

Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill's hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.
机译：底部填充是减少倒装芯片封装中硅芯片和基板之间热膨胀系数（CTE）不匹配导致的热应力影响的重要过程。本文报道了大口径陶瓷倒装芯片球栅阵列（FC-CBGA）在固化过程中底部填充材料的硬度模式。将商业胺基底部填充环氧树脂分配到HiCTE FC-CBGA中，并在固化炉中采用两步固化曲线的新方法进行固化。纳米识别测试用于研究固化步骤中底部填充环氧树脂的硬度。结果显示固化后的圆角区域和包装中心的硬度几乎相似，呈现出均匀的固化状态。由于在第二保温温度期间60分钟和120分钟后硬度没有显着差异，因此潜在地减少了生产中的总固化时间/周期。

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  • 来源
    《Fracture and strength of solids VII》|2010年|p.1194-1199|共6页
  • 会议地点 Kuala Lumpur(MY);Kuala Lumpur(MY)
  • 作者

    Zainudin Kornain; Azman Jalar; Rozaidi Rasid; Shahrum Abdullah;

  • 作者单位

    lnstitue of Microengineering and Nanoelectronics (IMEN) 43600 Universiti Kebangsaan Malaysia (UKM) Bangi, Selangor, Malaysia Freescale Semiconductor Sdn. Bhd47300 Petaling Jaya, Selangor, Malaysia;

    lnstitue of Microengineering and Nanoelectronics (IMEN) 43600 Universiti Kebangsaan Malaysia (UKM) Bangi, Selangor, Malaysia;

    lnstitue of Microengineering and Nanoelectronics (IMEN) 43600 Universiti Kebangsaan Malaysia (UKM) Bangi, Selangor, Malaysia;

    lnstitue of Microengineering and Nanoelectronics (IMEN) 43600 Universiti Kebangsaan Malaysia (UKM) Bangi, Selangor, Malaysia;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料一般性问题;
  • 关键词

    Curing profile; Ceramic Flip Chip Packaging; Hardness, Nanoindenter; Underfill;

    机译：固化轮廓陶瓷倒装芯片包装；硬度，纳米压痕；底胶;

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