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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >Packaging of GaAs Chips for Use in RF MCM Products
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Packaging of GaAs Chips for Use in RF MCM Products

机译：用于射频MCM产品的GaAs芯片的包装

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摘要

Incorporation of GaAs devices in a multi-chip module (MCM) process in which the chips are put down first,rnfollowed by buildup of their interconnect structure, presents several problems. First, GaAs devices are much thinnerrnthan the silicon chips and passive components that are typically used. Second, a low impedance electricalrnconnection to the backside of the GaAs device is usually required. And third, it is desirable to surround the chiprnwith a metal shield structure. All three of these issues have been addressed with a chip scale package fabricatedrnfrom sheet copper stock. This package is fabricated by etching cavities through the sheet to form the die cavity.rnNext, Kapton film is bonded to one side of the sheet, to form the package bottom. Then, the entire chip cavity isrnmetalized with gold. The metallized sheet is then mounted to a thermal release tape so that the individual carriersrncan be diced from the substrate. The device is bonded to the bottom of the carrier with conductive adhesive. Thernfully assembled package is then removed from the thermal released tape after the curing the conductive material.rnThe package has proven to be robust, fully compatible with the MCM assembly process, and also offers somernbenefits with respect to thermal management.
机译：将GaAs器件并入多芯片模块（MCM）工艺中，首先将芯片放下，然后再建立互连结构，这会带来一些问题。首先，GaAs器件比通常使用的硅芯片和无源组件薄得多。其次，通常需要与GaAs器件背面的低阻抗电连接。第三，期望用金属屏蔽结构围绕芯片。所有这三个问题都已通过由片状铜原料制成的芯片级封装得到解决。通过蚀刻穿过片材的腔以形成模腔来制造该包装。接着，将Kapton膜粘合到片的一侧，以形成包装底部。然后，整个芯片腔用金金属化。然后将金属化的板安装到热释放带上，从而可以从基板上切下各个载体。该装置通过导电粘合剂粘结到载体的底部。固化了导电材料后，将组装好的包装从热敏胶带上取下。事实证明，该包装坚固耐用，与MCM组装工艺完全兼容，并且在热管理方面也有好处。

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