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首页> 外文会议>IMAPS 40th international symposium on microelectronics >An Ultra High Performance 1Tbps bandwidth Optoelectronic LSI Package using Post-reflow optical-interface Stacking Technique
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An Ultra High Performance 1Tbps bandwidth Optoelectronic LSI Package using Post-reflow optical-interface Stacking Technique

机译：采用回流后光接口堆叠技术的超高性能1Tbps带宽光电LSI封装

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An optoelectronic LSI package with the I/O bandwidth of over 1Tbps was developed for the first time in the world. This optoelectronic LSI package is prepared with eight 12ch multimode optical fiber arrays,and has optical interconnection line of 96ch in all. Each optical interconnection channel has a 10.7Gbps wiring bandwidth,and total I/O capacity has broken through the wall of 1Tbps and become 1.0272Tbps. The optoelectronic package introduced here can use solder reflow process by Post-reflow Optical-interface Stacking Technique (POST) at the time of board assembling. It enables the ultra high-speed system of the Tera-bit class on cheap FR-4 board using a general mass-production mounting process. And the big advantage for realizing high efficient next-generation MPU was acquired by having realizing such a broadband LSI package.rn We have already reported a 256Gbps POST LSI package which has electrical contacts with 500um pitch between the LSI interposer and the optical interface module. In order to realize higher interconnection density,we developed a novel electrical contact. A mechanical alignment structure contributed to the realization of the electrical contacts with 250um pitch. We confirmed that the eye diagram of transmission characteristics at electrical contacts was clearly opened at 12.5Gbps/ch. The size of 1Tbps POST LSI package is 54mm x 54mm for a 12.5mm square LSI chip.
机译：I / O带宽超过1Tbps的光电LSI封装在世界上首次被开发出来。该光电LSI封装由8个12通道多模光纤阵列制成，共有96通道的光互连线。每个光互连通道具有10.7Gbps的布线带宽，总I / O容量突破了1Tbps的壁垒，变为1.0272Tbps。此处介绍的光电封装可在电路板组装时通过后回流光接口堆叠技术（POST）使用回流焊工艺。它使用常规的批量生产安装工艺在便宜的FR-4板上实现了Tera位级的超高速系统。通过实现这种宽带LSI封装，获得了实现高效下一代MPU的巨大优势。我们已经报道了一种256Gbps POST LSI封装，该封装在LSI中介层和光接口模块之间具有500um间距的电接触。为了实现更高的互连密度，我们开发了一种新颖的电触点。机械对准结构有助于实现250um间距的电触点。我们确认，电触点传输特性的眼图清楚地以12.5Gbps / ch打开。对于12.5mm正方形LSI芯片，1Tbps POST LSI封装的尺寸为54mm x 54mm。

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