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Techniques for Investigation of Solder Interconnect Electromigration under Time Varying Current Stressing

机译：时变电流应力下焊料互连电迁移的研究技术

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摘要

This paper reviews and summarizes previous research of symmetrically alternating and pulsed current stimulus electromigration in device interconnects serving as a historical précis providing a foundation and motivation for further research into of electromigration under arbitrary current profiles. Modified mean time to failure models for interconnects under both unidirectional and bidirectional pulsed are discussed. rnOngoing research is presented. Early modeling and calculations which take into account non-uniform current densities due to frequency effects are presented. Finite element modeling will focus on primary operating frequency,interconnect size,and interconnect shape and how these parameters dictate the current density profile.
机译：本文回顾并总结了以前在器件互连中对称交流和脉冲电流刺激电迁移的研究，作为历史惯例，为进一步研究任意电流曲线下的电迁移提供了基础和动力。讨论了在单向和双向脉冲下互连的修正平均失效时间模型。 rn正在进行研究。提出了早期建模和计算，这些建模和计算考虑了由于频率效应引起的电流密度不均匀。有限元建模将集中在主要工作频率，互连尺寸和互连形状以及这些参数如何决定电流密度曲线上。

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