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Innovative Technique of Shielding for RF Applications at Package Level

机译：封装级射频应用屏蔽的创新技术

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摘要

There are many different shielding technologies available for EMI shielding in Radio Frequency (RF) applications. A comparison is made between different EMI shielding technologies along with a discussion of providing EMI shielding at the package level. This novel concept of providing EMI shielding at the package level provides improvements in form factor,easy of use,and cost compared to traditional shielding approaches. rnA comparison is made between traditional PCB board level approaches like metal cans or lids and emerging package level technologies such as conductive paint,sputtered metal,and plating. Electrical performance,manufacturability,and reliability between the different packaging technologies are discussed. A look at the advantages and limitations between these different EMI shielding technologies is also shown. All of the shields must provide protection from RF/EMI interference.
机译：在射频（RF）应用中，有许多不同的屏蔽技术可用于EMI屏蔽。在不同的EMI屏蔽技术之间进行了比较，并讨论了在封装级别提供EMI屏蔽的问题。与传统的屏蔽方法相比，这种在封装级别提供EMI屏蔽的新颖概念可改善尺寸，易于使用和降低成本。 rn在传统的PCB板级方法（如金属罐或盖子）与新兴的封装级技术（如导电涂料，溅射金属和电镀）之间进行了比较。讨论了不同包装技术之间的电气性能，可制造性和可靠性。还显示了这些不同的EMI屏蔽技术之间的优缺点。所有屏蔽都必须提供针对RF / EMI干扰的保护。

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