Engineering of Silicon Wafers for MEMS Applications

机译：MEMS应用的硅晶圆工程

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The drivers for technology development in MEMS include greater functionality and lower cost per device. This can be seen in silicon wafers used for MEMS applications as well. Development of silicon material and special wafer for MEMS applications are discussed, including different types of etch stops in epitaxial wafers, SOI wafers, adding pre-etched cavities in SOI, and thick polysilicon films on insulator.

机译：MEMS技术发展的驱动力包括更高的功能和更低的每台设备成本。这也可以在用于MEMS应用的硅晶片中看到。讨论了用于MEMS应用的硅材料和特殊晶片的开发，包括外延晶片，SOI晶片中的不同类型的蚀刻停止层，在SOI中添加预蚀刻的腔体以及绝缘体上的厚多晶硅膜。

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来源
《International Commercialization of Micro and Nano Systems Conference; 20050821-25; Baden-Baden(DE)》|2005年|P.251-254|共4页
会议地点 Baden-Baden(DE)
作者
J. Maekinen; M. Tilli;
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作者单位

Okmetic Oyj, P.O. Box 44, 01301 Vantaa, Finland;

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会议组织
原文格式 PDF
正文语种 eng
中图分类管理学;
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4. Engineering of Silicon Wafers for MEMS Applications [C] . J. Maekinen, M. Tilli, Micro and Nanotechnology Commercialization Education Foundation(MANCEF), International Commercialization of Micro and Nano Systems Conference . 2005

机译：MEMS应用的硅晶片工程
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Engineering of Silicon Wafers for MEMS Applications

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