首页> 外文会议>International Conference on Nitride Semiconductors(ICNS-5); 20030525-20030530; Nara; JP >Low interface state density AlGaN/GaN MOSHFETs with photochemical vapor deposition SiO_2 layers
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Low interface state density AlGaN/GaN MOSHFETs with photochemical vapor deposition SiO_2 layers

机译:具有光化学气相沉积SiO_2层的低界面态密度AlGaN / GaN MOSHFET

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摘要

High quality SiO_2 was successfully deposited onto AlGaN by photo chemical vapor deposition (photo-CVD) using D_2 lamp as the excitation source. It was found that the interface state density was only 1.1 x 10~(11) cm~(-2)eV~(-1). AlGaN/GaN metal-oxide-semiconductor heterojunction field effect transistors (MOSHFETs) were also fabricated with such photo-CVD oxide as the insulating layer. Compared with AlGaN/GaN metal-semiconductor HFETs (MESHFETs) with similar structure, it was found that we could reduce the gate leakage current by more than four orders of magnitude by inserting the 32 nm-thick photo-CVD SiO_2 layer between AlGaN/GaN and gate metal. With a 1 μm gate length, it was found that room temperature saturated I_(ds), maximum g_m and gate voltage swing (GVS) of the fabricated nitride-based MOSHFET are 800 mA/mm, 86 mS/mm and 9 V, respectively.
机译:以D_2灯为激发源,通过光化学气相沉积(photo-CVD)成功地在AlGaN上沉积了高质量的SiO_2。发现界面态密度仅为1.1×10〜(11)cm〜(-2)eV〜(-1)。还使用这种光CVD氧化物作为绝缘层来制造AlGaN / GaN金属氧化物半导体异质结场效应晶体管(MOSHFET)。与具有类似结构的AlGaN / GaN金属半导体HFET(MESHFET)相比,我们发现,通过在AlGaN / GaN之间插入32 nm厚的光化学CVD SiO_2层,可以将栅极漏电流降低四个数量级以上。和门金属。栅极长度为1μm时,发现制造的氮化物基MOSHFET的室温饱和I_(ds),最大g_m和栅极电压摆幅(GVS)分别为800 mA / mm,86 mS / mm和9V。 。

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