首页> 外文会议>International Conference on Silicon Carbide and Related Materials 2001 Pt.1 Oct 28-Nov 2, 2001 Tsukuba, Japan >Formation of Extremely Thin, Quasi-Single-Domain 3C-SiC Film on Resistively Heated On-Axis Si(001) Substrate Using Organo-Silane Buffer Layer
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Formation of Extremely Thin, Quasi-Single-Domain 3C-SiC Film on Resistively Heated On-Axis Si(001) Substrate Using Organo-Silane Buffer Layer

机译:使用有机硅烷缓冲层在电阻加热的轴Si(001)衬底上形成极薄的准单域3C-SiC膜

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摘要

We have successfully grown extremely thin, quasi-single-domain 3C-SiC films on resistively heated on-aixs Si(001) substrate by forming a low-temperature interfacial buffer layer using monomethylsilane (CH_3-SiH_3). The thickness of the film is as thin as 45-100 nm, which is compared to that required in a previous study (>5 μm). Both the Si(001)2x1 single-domain and the Si(001)2x1+1x2 double-domain surfaces were found to successfully yield quasi-single-domain 3C-SiC(001)2x3 films. The observed development of the single domain is understood in terms of the electromigration during resistive heating as well as the unique adsorption nature of the monomethylsilane.
机译:通过使用单甲基硅烷(CH_3-SiH_3)形成低温界面缓冲层,我们已经在电阻加热的Si(001)衬底上成功生长了极薄的准单畴3C-SiC薄膜。膜的厚度薄至45-100 nm,与先前研究中要求的厚度相比(> 5μm)。发现Si(001)2x1单畴和Si(001)2x1 + 1x2双畴表面均成功制备了准单畴3C-SiC(001)2x3膜。可以从电阻加热过程中的电迁移以及单甲基硅烷的独特吸附特性来理解观察到的单畴发展。

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