• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>International conference on soldering and reliability 2008 >IMPACT OF SOLDERING ATMOSPHERE ON SOLDER JOINT FORMATION
【24h】

IMPACT OF SOLDERING ATMOSPHERE ON SOLDER JOINT FORMATION

机译：焊接气氛对焊接接头形成的影响

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

The 2007 INEMI roadmap identified the increase of usage of nitrogen in the reflow and wave soldering processes due to the lower wetting forces of the lead free solders. While flux chemistries evolve and improve to promote wetting of lead free alloys, it will take many iterations to get the desired results. Therefore the use of nitrogen is unavoidable and will significantly increase the cost of operation. The INEMI roadmap emphasis that equipment manufacturers should reduce the amount of nitrogen consumption by using better low volume inserting methods with a combination of advance flux chemistries.rnThis collaborative effort between Flextronics and Vitronics Soltec investigated different techniques that can significantly reduce nitrogen consumption without affecting the quality of the final assembly. It has studied the use of alternative nitrogen supply method such as applying nitrogen only on the reflow areas in combination with different oxygen ppm levels during reflow process and their impact on secondary wave soldering process of Cu OSP surface finish PCBs. The results of this investigation will provide basis to develop next generation reflow ovens.
机译：2007年的INEMI路线图确定，由于无铅焊料的润湿力较低，因此在回流焊和波峰焊工艺中氮的使用有所增加。随着助焊剂化学的发展和改进以促进无铅合金的浸润，将需要许多次迭代才能获得所需的结果。因此，氮的使用是不可避免的，并且将显着增加操作成本。 INEMI路线图强调设备制造商应通过结合使用先进的助焊剂化学方法使用更好的小体积插入方法来减少氮消耗量。最后组装的。它研究了替代性供氮方法的使用，例如在回流过程中仅将氮与不同的氧ppm水平结合应用于回流区域，以及它们对Cu OSP表面处理PCB的二次波峰焊过程的影响。研究的结果将为开发下一代回流焊炉提供基础。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号