LOW-SILVER BGA ASSEMBLY PHASE I - REFLOW CONSIDERATIONS AND JOINT HOMOGENEITY - INITIAL REPORT

著录项

• 来源
  《International conference on soldering and reliability 2008》|2008年|72-78|共7页
• 会议地点 Toronto(CA);Toronto(CA)
• 作者

  Chrys Shea; Ranjit Pandher; Ken Hubbard; Gnyaneshwar Ramakrishna; Ahmer Syed; Greg Henshall; Quyen Chu; Nick Tokotch; Lorraine Escuro; Mike Lapitan; Gary Ta; Anthony Babasa; Girish Wable;

  展开▼
• 作者单位

  Cookson Electronics South Plainfield, NJ, USA;

  Cookson Electronics South Plainfield, NJ, USA;

  Cisco Systems San Jose, CA, USA;

  Cisco Systems San Jose, CA, USA;

  Amkor Technology Chandler, AZ, USA;

  Hewlett-Packard Palo Alto, CA, USA;

  Jabil Circuit San Jose, CA, USA St. Petersburg, FL, USA;

  Jabil Circuit San Jose, CA, USA St. Petersburg, FL, USA;

  Jabil Circuit San Jose, CA, USA St. Petersburg, FL, USA;

  Jabil Circuit San Jose, CA, USA St. Petersburg, FL, USA;

  Jabil Circuit San Jose, CA, USA St. Petersburg, FL, USA;

  Jabil Circuit San Jose, CA, USA St. Petersburg, FL, USA;

  Jabil Circuit San Jose, CA, USA St. Petersburg, FL, USA;

  展开▼
• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 太阳能技术;
• 关键词

  lead-free; low silver; BGA; reflow; mixed metals;

  机译：无铅低银BGA；回流混合金属;