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Effect of reticle manufacturing quality on full chip optical proximity correction

机译:光罩制造质量对全芯片光学接近度校正的影响

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Abstract: Critical Dimensions (CD) are measured on reticles which are written incorporating an optical proximity correction for pitch dependent linewidth bias. Reticles are manufactured on different generations of laser write tools and the result in terms of mean ann range of dimensions compared. Lithography simulation is used to test the response of reticle CD variation at wafer level. !5
机译:摘要:关键尺寸(CD)是在标线板上测量的,标线包含针对间距相关的线宽偏差的光学接近校正。光罩是在不同代的激光写入工具上制造的,其结果在尺寸的平均和范围上进行了比较。光刻模拟用于测试晶圆级别的标线片CD变化的响应。 !5

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